Thermal Management of Electronics

SP provides services in thermal management of electronics.

Detailed thermal analysis of an electronic design extending from the chip to the system packaging level, using both our expert knowledge and the Computational Fluid Dynamics (CFD) simulation tools, our customers receive thermal design guidelines for their products.

The problems that might be addressed are, for example,  the choice of electronics packaging materials, such as PCB substrates, and cooling techniques, such as vents, heat-sinks, heat spreaders or fans, early in product design, as well as ruggedizing / upgrading an existing product for use / storage in harsh thermal environment.

The services also include evaluation of “keep-it-warm” anti-moisture methods in the product’s enclosures of complex shape, and assistance in process design, such as virtual solder reflow oven profiling.

Based on the product specification SP can perform parametric study and/or simulation-based design optimization taking into account manufacturing cost and technology constraints,  to reduce the time-to-market for new products and save product development costs.

RISE Research Institutes of Sweden, Phone 010-516 50 00, E-mail

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